Submicron void formation in amorphous NiZr alloys

King-Ning Tu*, T. C. Chou

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

46 Scopus citations

Abstract

A trilayer thin film of amorphous alloys Ni40Zr60/Ni73Zr27/Ni40Zr60 has been deposited on nitrided Si surface, annealed at 200, 250, and 300°C in He, and analyzed by Rutherford backscattering spectroscopy and cross-sectional transmission electron microscopy. Interdiffusion occurred without crystallization. When Ni was the dominant diffusing species, no voids were seen. When both Ni and Zr diffuse, submicron size voids were observed within the alloy. These observations indicated that self-diffusion in the amorphous alloy can be mediated by localized vacancylike defects as well as by nonlocalized free-volume defects. Also, void formation as a result of the slower diffusing species is opposite to Kirkendall effect in diffusion couples of crystalline solids.

Original languageEnglish
Pages (from-to)1863-1866
Number of pages4
JournalPhysical Review Letters
Volume61
Issue number16
DOIs
StatePublished - 1 Jan 1988

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