Submicron CMOS thermal noise modeling from an RF perspective

Jeffrey J. Ou*, Xiaodong Jin, Chen-Ming Hu, Paul R. Gray

*Corresponding author for this work

Research output: Contribution to journalConference article

13 Scopus citations

Abstract

Continuous scaling of submicron CMOS technologies will soon make low cost, wireless system-on-a-chip communication products possible. The ultimate goal of these systems is to integrate the entire RF front-end with DSP together on a single chip. One key issue to the success of this CMOS RF system LSI chip implementation is how to accurately predict circuit performance using simulators such as SPICE. This will require accurate RF AC and noise models. The latter is essential for optimizing the noise performance which will in turn lead to a low power design. Recently, several CMOS RF models have been proposed for improvement on the accuracy of AC analysis at high frequencies (Ou et al, 1998). However, the accuracy of the existing noise models is not satisfactory for submicron CMOS. In this paper, a physics-based RF thermal noise model is proposed for submicron CMOS devices with a channel thermal noise model, resulting in a nearly bias-independent noise factor /spl gamma/. This model shows good agreement with measured RF noise data across a wide range of bias conditions.

Original languageEnglish
Pages (from-to)151-152
Number of pages2
JournalDigest of Technical Papers - Symposium on VLSI Technology
DOIs
StatePublished - 1 Dec 1999
EventProceedings of the 1999 Symposium on VLSI Technology - Kyoto, Jpn
Duration: 14 Jun 199916 Jun 1999

Fingerprint Dive into the research topics of 'Submicron CMOS thermal noise modeling from an RF perspective'. Together they form a unique fingerprint.

Cite this