Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope

G. E. Ice*, B. C. Larson, F. J. Walker, K. S. Chung, W. Yang, J. D. Budai, J. Z. Tischler, N. Tamura, Haydn Chen, J. S. Chung, W. Lowe

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

Characterization of stress has long been recognized as essential for the prediction of materials behavior. However, direct three-dimensional (3-D) measurements of sub-grain microscopic stress tensor distributions have not been available to guide theories of mesoscale dynamics. Here we report on advances in software and instrumentation that make it possible to determine 3-D stress tensor distributions in polycrystalline materials with a spatial resolution below the grain size of most materials. Based on the success of a prototype, a powerful 3-D x-ray crystal microscope is now being constructed to push stress measurements to gauge volumes less than 0.25 cubic microns. The UnicatII beamline 34-ID microscope will provide new information certain to challenge emerging models of mesoscale dynamics and to identify and quantify previously hidden mesoscopic processes.

Original languageEnglish
Pages402-407
Number of pages6
StatePublished - 1 Dec 2000
EventHeat Treating: Proceedings of the 20th Conference - St. Louis, MO, United States
Duration: 9 Oct 200012 Oct 2000

Conference

ConferenceHeat Treating: Proceedings of the 20th Conference
CountryUnited States
CitySt. Louis, MO
Period9/10/0012/10/00

Fingerprint Dive into the research topics of 'Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope'. Together they form a unique fingerprint.

Cite this