Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope

G. E. Ice; B. C. Larson; F. J. Walker; K. S. Chung; W. Yang; J. D. Budai; J. Z. Tischler; N. Tamura; Haydn Chen; J. S. Chung; W. Lowe

Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope

G. E. Ice^*, B. C. Larson, F. J. Walker, K. S. Chung, W. Yang, J. D. Budai, J. Z. Tischler, N. Tamura, Haydn Chen, J. S. Chung, W. Lowe

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to conference › Paper › peer-review

Abstract

Characterization of stress has long been recognized as essential for the prediction of materials behavior. However, direct three-dimensional (3-D) measurements of sub-grain microscopic stress tensor distributions have not been available to guide theories of mesoscale dynamics. Here we report on advances in software and instrumentation that make it possible to determine 3-D stress tensor distributions in polycrystalline materials with a spatial resolution below the grain size of most materials. Based on the success of a prototype, a powerful 3-D x-ray crystal microscope is now being constructed to push stress measurements to gauge volumes less than 0.25 cubic microns. The UnicatII beamline 34-ID microscope will provide new information certain to challenge emerging models of mesoscale dynamics and to identify and quantify previously hidden mesoscopic processes.

Original language	English
Pages	402-407
Number of pages	6
State	Published - 1 Dec 2000
Event	Heat Treating: Proceedings of the 20th Conference - St. Louis, MO, United States Duration: 9 Oct 2000 → 12 Oct 2000

Conference

Conference	Heat Treating: Proceedings of the 20th Conference
Country	United States
City	St. Louis, MO
Period	9/10/00 → 12/10/00

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@conference{5b5c51a1170940d8bf39bc168b488b91,

title = "Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope",

abstract = "Characterization of stress has long been recognized as essential for the prediction of materials behavior. However, direct three-dimensional (3-D) measurements of sub-grain microscopic stress tensor distributions have not been available to guide theories of mesoscale dynamics. Here we report on advances in software and instrumentation that make it possible to determine 3-D stress tensor distributions in polycrystalline materials with a spatial resolution below the grain size of most materials. Based on the success of a prototype, a powerful 3-D x-ray crystal microscope is now being constructed to push stress measurements to gauge volumes less than 0.25 cubic microns. The UnicatII beamline 34-ID microscope will provide new information certain to challenge emerging models of mesoscale dynamics and to identify and quantify previously hidden mesoscopic processes.",

author = "Ice, {G. E.} and Larson, {B. C.} and Walker, {F. J.} and Chung, {K. S.} and W. Yang and Budai, {J. D.} and Tischler, {J. Z.} and N. Tamura and Haydn Chen and Chung, {J. S.} and W. Lowe",

year = "2000",

month = dec,

day = "1",

language = "English",

pages = "402--407",

note = "null ; Conference date: 09-10-2000 Through 12-10-2000",

}

Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope. / Ice, G. E.; Larson, B. C.; Walker, F. J.; Chung, K. S.; Yang, W.; Budai, J. D.; Tischler, J. Z.; Tamura, N.; Chen, Haydn; Chung, J. S.; Lowe, W.

2000. 402-407 Paper presented at Heat Treating: Proceedings of the 20th Conference, St. Louis, MO, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope

AU - Ice, G. E.

AU - Larson, B. C.

AU - Walker, F. J.

AU - Chung, K. S.

AU - Yang, W.

AU - Budai, J. D.

AU - Tischler, J. Z.

AU - Tamura, N.

AU - Chen, Haydn

AU - Chung, J. S.

AU - Lowe, W.

PY - 2000/12/1

Y1 - 2000/12/1

N2 - Characterization of stress has long been recognized as essential for the prediction of materials behavior. However, direct three-dimensional (3-D) measurements of sub-grain microscopic stress tensor distributions have not been available to guide theories of mesoscale dynamics. Here we report on advances in software and instrumentation that make it possible to determine 3-D stress tensor distributions in polycrystalline materials with a spatial resolution below the grain size of most materials. Based on the success of a prototype, a powerful 3-D x-ray crystal microscope is now being constructed to push stress measurements to gauge volumes less than 0.25 cubic microns. The UnicatII beamline 34-ID microscope will provide new information certain to challenge emerging models of mesoscale dynamics and to identify and quantify previously hidden mesoscopic processes.

AB - Characterization of stress has long been recognized as essential for the prediction of materials behavior. However, direct three-dimensional (3-D) measurements of sub-grain microscopic stress tensor distributions have not been available to guide theories of mesoscale dynamics. Here we report on advances in software and instrumentation that make it possible to determine 3-D stress tensor distributions in polycrystalline materials with a spatial resolution below the grain size of most materials. Based on the success of a prototype, a powerful 3-D x-ray crystal microscope is now being constructed to push stress measurements to gauge volumes less than 0.25 cubic microns. The UnicatII beamline 34-ID microscope will provide new information certain to challenge emerging models of mesoscale dynamics and to identify and quantify previously hidden mesoscopic processes.

UR - http://www.scopus.com/inward/record.url?scp=10744232786&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:10744232786

SP - 402

EP - 407

Y2 - 9 October 2000 through 12 October 2000

ER -

Sub-Grain Measurement of Stress with a 3-D X-Ray Microscope

Abstract

Conference

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