SU-8 flexible ribbon cable for biomedical microsystem interconnection

Tzu Yuan Chao*, Kuei Shu Li, Yu-Ting Cheng

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The paper presents a flexible interconnecting scheme with a wafer-level process to fabricate a SU-8 flexible ribbon cable for biomedical microsystem interconnection. Combining with a low temperature Au-Au thermocompressive bond (<200°C), the cable with 40 metal lines can provide mechanical and electrical connections between biomedical probes and external circuit chips. ∼3.3 MPa shear bonding strength can be achieved between the contacts formed on a silicon based microprobe and the ribbon cable, respectively. Meanwhile, ∼8.82×10-7 Ω·cm2 specific contact resistance has been measured between the contacts formed on the SU-8 and CMOS substrates, respectively. The experimental results have shown potential applications of the flexible interconnecting scheme for the heterogeneous integration of biomedical microsystems.

Original languageEnglish
Title of host publicationNEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Pages622-625
Number of pages4
DOIs
StatePublished - 4 Oct 2011
Event6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
Duration: 20 Feb 201123 Feb 2011

Publication series

NameNEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Conference

Conference6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
CountryTaiwan
CityKaohsiung
Period20/02/1123/02/11

Keywords

  • Au-Au Thermocompressive bonding
  • Flexible spiral ribbon cable
  • Heterogeneous integration
  • Stress release
  • SU-8

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  • Cite this

    Chao, T. Y., Li, K. S., & Cheng, Y-T. (2011). SU-8 flexible ribbon cable for biomedical microsystem interconnection. In NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 622-625). [6017432] (NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems). https://doi.org/10.1109/NEMS.2011.6017432