Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

Cheng Ta Ko, Kai Ming Yang, Jim Wein Lin, Chih Lun Wang, Tzu Chieh Chou, Yu Tao Yang, Ting Yang Yu, Yu Hua Chen, Kuan-Neng Chen, Tzyy Jang Tseng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

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Chemical Compounds

Engineering & Materials Science