Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

Cheng Ta Ko, Kai Ming Yang, Jim Wein Lin, Chih Lun Wang, Tzu Chieh Chou, Yu Tao Yang, Ting Yang Yu, Yu Hua Chen, Kuan-Neng Chen, Tzyy Jang Tseng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
StatePublished - 13 Jun 2017
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: 16 May 201718 May 2017

Publication series

NameProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Conference

Conference5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period16/05/1718/05/17

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