Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

Y. W. Chang, S. W. Liang, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

60 Scopus citations

Abstract

Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 °C, and the bump resistance increased only 0.02 mil in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration.

Original languageEnglish
Article number032103
JournalApplied Physics Letters
Volume89
Issue number3
DOIs
StatePublished - 28 Jul 2006

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