Study of self-assembly technology for 3D integration applications

Hsiao Chun Chang, Cheng Han Fan, Yi-Chia Chou, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality of hydrophobic film with self-assembled monolayers (SAMs) based on self-assembled mechanism strongly affects the performance of alignment. The surface quality of SAMs film which depends on experimental parameters such as dip-coating time and heating time is critical to determine the accuracy of alignment. Moreover, the chip shape and size also have an impact on the alignment accuracy. By improving the misalignment, a good design by the self-assembled mechanism for the self-alignment method can be applied in the bonding technology.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages237-240
Number of pages4
ISBN (Electronic)9781467383561
DOIs
StatePublished - 23 Dec 2015
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan
Duration: 21 Oct 201523 Oct 2015

Publication series

Name2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Conference

Conference10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan
CityTaipei
Period21/10/1523/10/15

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