Study of nano-twinned Cu prepared by low-temperature electrodeposition and its thermal stability

Yen Chieh Chen, Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

It had been shown that nanotwinned Cu (nt-Cu) possess a lot of advantages, including high strength and ductility with a little bit enhancement of electrical conductivity. In addition, it has a great potential to apply on 3-dimensional integrated circuits (3D IC), which is believed to be an advanced method to increase the density of joints in the field of packaging technology with respect to scaling. Thus, many studies have been dedicated to seeking the best conditions to produce nt-Cu with distinguished properties by changing a lot of parameters including current density, films thickness, electrodeposition mode, etc. It had been reported that nt-Cu could be fabricated successfully by pulse-current mode. Besides, it could also be fabricated by direct-current (DC) mode from the previous research [1]. While undergoing the process of electrodeposition, Cu films can form nanotwins because of stress relaxation [2]. Moreover, if we want to judge on the preferred orientation after thermal treatments, film thickness needs to be considered [3]. With different current density, the microstructure of Cu films changes as well [4]. Temperature always play a vital role speaking of materials science, however, there is just little understanding concerning the effect of temperature of electrodeposition. In the present study, we examine the changes of the microstructure with plating temperatures and investigate the thermal properties after annealing processes under different conditions.

Original languageEnglish
Title of host publication11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
PublisherIEEE Computer Society
Pages135-138
Number of pages4
ISBN (Electronic)9781509047697
DOIs
StatePublished - 27 Dec 2016
Event11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan
Duration: 26 Oct 201628 Oct 2016

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
CountryTaiwan
CityTaipei
Period26/10/1628/10/16

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    Chen, Y. C., & Chen, C. (2016). Study of nano-twinned Cu prepared by low-temperature electrodeposition and its thermal stability. In 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings (pp. 135-138). [7800031] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2016.7800031