@inproceedings{f18f4ea0dde24a019e046d2433d786bb,
title = "Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression",
abstract = "Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.",
author = "Shen, {Yu An} and Chih Chen",
year = "2015",
month = dec,
day = "23",
doi = "10.1109/IMPACT.2015.7365216",
language = "English",
series = "2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "204--206",
booktitle = "2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings",
address = "United States",
note = "null ; Conference date: 21-10-2015 Through 23-10-2015",
}