Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression

Yu An Shen; Chih Chen

doi:10.1109/IMPACT.2015.7365216

Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression

Yu An Shen, Chih Chen

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.

Original language	English
Title of host publication	2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	204-206
Number of pages	3
ISBN (Electronic)	9781467383561
DOIs	https://doi.org/10.1109/IMPACT.2015.7365216
State	Published - 23 Dec 2015
Event	10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan Duration: 21 Oct 2015 → 23 Oct 2015

Publication series

Name	2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Conference

Conference	10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
Country	Taiwan
City	Taipei
Period	21/10/15 → 23/10/15

Access to Document

10.1109/IMPACT.2015.7365216

Link to publication in Scopus

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Shen, Y. A., & Chen, C. (2015). Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 204-206). [7365216] (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365216

Shen, Yu An ; Chen, Chih. / Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 204-206 (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

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title = "Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression",

abstract = "Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.",

author = "Shen, {Yu An} and Chih Chen",

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Shen, YA & Chen, C 2015, Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings., 7365216, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 204-206, 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015, Taipei, Taiwan, 21/10/15. https://doi.org/10.1109/IMPACT.2015.7365216

Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. / Shen, Yu An; Chen, Chih.

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. p. 204-206 7365216 (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Shen, Yu An

AU - Chen, Chih

PY - 2015/12/23

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N2 - Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.

AB - Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.

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T3 - 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

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BT - 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

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Shen YA, Chen C. Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2015. p. 204-206. 7365216. (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings). https://doi.org/10.1109/IMPACT.2015.7365216