Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression

Yu An Shen, Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages204-206
Number of pages3
ISBN (Electronic)9781467383561
DOIs
StatePublished - 23 Dec 2015
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan
Duration: 21 Oct 201523 Oct 2015

Publication series

Name2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Conference

Conference10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan
CityTaipei
Period21/10/1523/10/15

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    Shen, Y. A., & Chen, C. (2015). Study of grain size and orientation of 30 μm solder microbumps bonded by thermal compression. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 204-206). [7365216] (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365216