Study of electromigration of flip-chip solder joints using Kelvin probes

Y. W. Chang*, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 15°C, and the bump resistance increased only 0.02 m in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration.

Original languageEnglish
Title of host publicationSTRESS-INDUCED PHENOMENA IN METALLIZATION
Subtitle of host publicationNinth International Workshop on Stress-Induced Phenomena in Metallization
Pages194-201
Number of pages8
DOIs
StatePublished - 14 Dec 2007
Event9th International Workshop on Stress-Induced Phenomena in Metallization - Kyoto, Japan
Duration: 4 Apr 20077 Apr 2007

Publication series

NameAIP Conference Proceedings
Volume945
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference9th International Workshop on Stress-Induced Phenomena in Metallization
CountryJapan
CityKyoto
Period4/04/077/04/07

Keywords

  • Electromigration in solder joints
  • Kelvin structure

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