Studies on the interfaces and adhesion mechanisms in reinforced diamond composite coatings

Chuen-Tinn Tsai, J. C. Nelson, W. W. Gerberich*, D. Z. Liu, J. Heberlein, E. Pfender

*Corresponding author for this work

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

Metal-reinforced diamond composite films produced by a three-step process are studied by examining the nature and interaction of the three types of interfaces present in the composite: diamond-substrate, binder-substrate and diamond-binder. Diamond composites were deposited on tungsten substrates with nickel or CuTiAg alloy binders. It is found that a diffusion bond formed between the binder and the substrate. In addition, carbide-forming elements are found to segregate to the diamond-binder interface. The binding state of the diffused elements was studied by examining the fine structure of the Auger spectra. Carbon at the interface between the binder and the diamond is found to have carbide-type bonding which should improve the adherence of the binder to the diamond.

Original languageEnglish
Pages (from-to)181-186
Number of pages6
JournalThin Solid Films
Volume237
Issue number1-2
DOIs
StatePublished - 1 Jan 1994

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    Tsai, C-T., Nelson, J. C., Gerberich, W. W., Liu, D. Z., Heberlein, J., & Pfender, E. (1994). Studies on the interfaces and adhesion mechanisms in reinforced diamond composite coatings. Thin Solid Films, 237(1-2), 181-186. https://doi.org/10.1016/0040-6090(94)90258-5