Structural fabrication of a ring-type motion sensor

Jui Hong Weng*, Wei-Hua Chieng, Jenn Min Lai

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

The structural fabrication of a ring-type motion sensor is described. This micromachined ring-type sensor can be used to detect both yaw rate and linear acceleration. The fabrication is based on deep silicon etching and wafer bonding. An aspect ratio dependent effect (ARDE) always occurs in the dry etching process for a micro electromechanical systems (MEMS) device. Additionally, three processes are developed and modified progressively for eliminating ARDE from the fabrication results. Results indicate that the proposed process provides more flexibility than other processes with respect to the structural fabrication of a MEMS device. The sensitivity of-the sensor characteristic to the manufacturing errors is considered as well.

Original languageEnglish
Pages (from-to)710-716
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume14
Issue number5
DOIs
StatePublished - 1 May 2004

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