Stability of nanoscale twins in copper under electric current stressing

Kuan Chia Chen; Wen-Wei Wu; Chien Neng Liao; Lih Juann Chen; King-Ning Tu

doi:10.1063/1.3483949

Stability of nanoscale twins in copper under electric current stressing

Kuan Chia Chen^*, Wen-Wei Wu, Chien Neng Liao, Lih Juann Chen, King-Ning Tu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability.

Original language	English
Article number	066103
Journal	Journal of Applied Physics
Volume	108
Issue number	6
DOIs	https://doi.org/10.1063/1.3483949
State	Published - 15 Sep 2010

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title = "Stability of nanoscale twins in copper under electric current stressing",

abstract = "Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability.",

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AU - Chen, Kuan Chia

AU - Wu, Wen-Wei

AU - Liao, Chien Neng

AU - Chen, Lih Juann

AU - Tu, King-Ning

PY - 2010/9/15

Y1 - 2010/9/15

N2 - Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability.

AB - Migration of {112} incoherent twin boundary (ITB) in nanotwinned Cu under electric current stressing has been observed using in situ high-resolution transmission electron microscopy. The current-driven ITB migration is found to be four orders of magnitude faster than that driven thermally. We propose that electric current plays a role of shuffling Cu atoms at ITB/coherent twin boundary junctions, which enhances nucleation of {112} steps and facilitates twin boundary migration in Cu. By understanding how twin boundaries respond to electric current force we shall be able to trace the property change in nanotwinned Cu under electric current stressing, which would be an essential assessment of interconnect reliability.

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Stability of nanoscale twins in copper under electric current stressing

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