Stability Enhancement of Silver Nanowire Patterns by Transferring Process

Gui-Shi Liu, Chuan Liu, Hui-Jiuan Chen, Han-Ping Shieh, Bo-Ru Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Silver nanowires (AgNWs) need to be patterned for using as transparent conductive electrodes (TCEs) in most electronic devices. Herein we propose a versatile technique which can fabricate AgNW patterns with enhanced adhesion to the substrate of polyethylene glycol terephthalate (PET). By using spin-coating, AgNWs were self-assembled into patterns on the surface of polydimethylsiloxane (PDMS) which had been patterned with high contrast of wettability by UV/O-3 exposure. To enhance the adhesion of AgNWs to substrate, the patterned AgNWs were embedded into epoxy resin (EPR) by a facile transferring process. The key to this process is the anti-adhesive groups (CH3) grafted on the oxidized PDMS to assist a clean exfoliation. The AgNW-EPR composite electrode exhibits excellent stability under adhesive tape test and long-term storage.
Original languageEnglish
Title of host publication5th International Symposium on Next-Generation Electronics (ISNE)
DOIs
StatePublished - 2016

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    Liu, G-S., Liu, C., Chen, H-J., Shieh, H-P., & Yang, B-R. (2016). Stability Enhancement of Silver Nanowire Patterns by Transferring Process. In 5th International Symposium on Next-Generation Electronics (ISNE) https://doi.org/10.1109/ISNE.2016.7543289