Spot cooling using electrowetting-controlled thin film heat transfer

Jiangtao Cheng, Chung-Lung Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

We report an electrowetting-controlled cooling system with site-specific treatments on the heat source (evaporator or hot spot) surfaces. Electrowetting-on-dielectric (EWOD) has great potential in thermal management because EWOD-driven droplet transport has unique characteristics of prompt response, low power consumption and programmable paths without the need for any mechanical moving parts. Prompt and fast droplet transport is necessary for adaptive and active cooling of high heat flux targets. Using a multi-channel DC/AC control system, we carried out sequenced activation of AC voltages on coplanar electrodes and transmitted a droplet to the spot target along a programmable path. With high positioning accuracy at the chip level, we have successfully transmitted a water droplet of 15 μL at speeds as high as ∼10 cm/s. We further improved electrowetting cooling performance by coating a fine copper screen on the cooling targets. The capillarity associated with the copper screen facilitates the delivered droplets automatically spreading and clinging to the target surfaces. As a result, heat transfer is in the more efficient form of filmwise evaporation at the evaporator sites. To maintain a thin film with proper thickness on the hot spots, we implemented EWOD-assisted droplet splitting and merging to precisely control the droplet volume to avoid fluid flooding (accumulation) on the hot spot surfaces. Our investigation indicates that thin-film evaporation is a high-efficiency heat transfer mechanism on a hydrophilized hot spot surface. Based on EWOD technique with surface treatments, the superheat on a hot spot of 4mm × 4mm was maintained well below 30 C even when the heat flux reached as high as 80W/cm2. The closed loop of this novel thermal management system can potentially function as a wickless vapor chamber or heat pipe with enhanced heat dissipation capabilities.

Original languageEnglish
Title of host publicationASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012
Pages275-281
Number of pages7
DOIs
StatePublished - 1 Dec 2012
EventASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012 - Atlanta, GA, United States
Duration: 3 Mar 20126 Mar 2012

Publication series

NameASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012

Conference

ConferenceASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012
CountryUnited States
CityAtlanta, GA
Period3/03/126/03/12

Fingerprint Dive into the research topics of 'Spot cooling using electrowetting-controlled thin film heat transfer'. Together they form a unique fingerprint.

  • Cite this

    Cheng, J., & Chen, C-L. (2012). Spot cooling using electrowetting-controlled thin film heat transfer. In ASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012 (pp. 275-281). (ASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012). https://doi.org/10.1115/MNHMT2012-75032