@inbook{8292f7c8c560470a93790bb6b2decd8a,
title = "Spontaneous Tin Whisker Growth: Mechanism and Prevention",
abstract = "Whisker growth on beta-tin (β-Sn) is a surface relief phenomenon of creep [1–16]. It is driven by a compressive stress gradient and occurs at room temperature. Spontaneous Sn whiskers are known to grow on matte Sn finish on Cu. Today, due to the wide application of Pb-free solders on Cu conductors used in the packaging of consumer electronic products, Sn whisker growth has become a serious reliability issue because the Sn-based Pb-free solders are very rich in Sn. The matrix of most Sn-based Pb-free solders is almost pure Sn. The well-known phenomena of tin such as tin-cry, tin-pest, and tin-whisker are receiving attention again.",
keywords = "Consumer Electronic Product, Deviatoric Strain Tensor, Laue Pattern, Stress Gradient, Whisker Growth",
author = "Tu, {King Ning}",
year = "2007",
month = jan,
day = "1",
doi = "10.1007/978-0-387-38892-2_6",
language = "English",
series = "Springer Series in Materials Science",
publisher = "Springer Verlag",
pages = "153--181",
booktitle = "Springer Series in Materials Science",
address = "Germany",
}