Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review


In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

Original languageEnglish
Pages (from-to)27-30
Number of pages4
JournalMaterials Research Society Symposium - Proceedings
StatePublished - 1 Dec 1997
EventProceedings of the 1996 MRS Fall Symposium - Boston, MA, USA
Duration: 3 Dec 19965 Dec 1996

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