Soldering reactions under space confinement for 3D IC applications

C. R. Kao*, H. Y. Chuang, W. M. Chen, T. L. Yang, M. S. Kuo, Y. J. Chen, J. J. Yu, C. C. Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

The microstructure features and the IMC kinetics of Cu-Sn and Ni-Sn soldering reaction under space confinement are studied in the present study. Experimentally, Cu/Sn(10 μm)/Cu and Ni/Sn(10 μm)/Ni sandwich structures were prepared through a hot-press bonding. Sn with a thickness of 10 μm was chosen to simulate the joints in 3D IC packages employing a severe space confinement. Microstructure characterisations showed that space confinement does not change the reaction products which are Cu 6Sn 5 and Cu 3Sn for Cu-Sn reactions and Ni 3Sn 4 for Ni-Sn reactions. However, it was found that the interfacial morphology is very different to that of the conventional joints. IMCs in the space confined reactions occupy a very large or even entirety volume in the joint. In addition, voiding occurs in both Cu/Sn/Cu and Ni/Sn/Ni reactions, which having great impacts on the joint strength. According to the kinetics analysis, the IMCs growth rates measured in the present work are in the range of literature results, suggesting that the space confinement behaviour has very little effects on the IMC growth kinetics.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages724-728
Number of pages5
DOIs
StatePublished - 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 29 May 20121 Jun 2012

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period29/05/121/06/12

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