Solder joints fabricated by explosively reacting nanolayers

M. S. Tong, D. Sturgess, King-Ning Tu, J. M. Yang

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

The intense bursts of heat released by explosively reacting multilayer foils can be controlled and used as heat sources in joining technologies. We use this method to produce Si/solder/Si joints to characterize the microstructure of the multilayer foil in the reacted state as well as the foil/solder interface. The resulting structure at the foil/solder interface is a nearly phase-separated, interlocking structure. The joint is tested using single lap shear Cu samples. Fracture surfaces have been analyzed and failure was observed to entirely occur within the solder layer.

Original languageEnglish
Article number144101
JournalApplied Physics Letters
Volume92
Issue number14
DOIs
StatePublished - 21 Apr 2008

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