Soft-mold-induced self-construction of polymer patterns under microwave irradiation

Fu-Hsiang Ko; Chia Tien Wu; Mei Fen Chen; Jem Kun Chen; Tieh Chi Chu

doi:10.1063/1.2737364

Soft-mold-induced self-construction of polymer patterns under microwave irradiation

Fu-Hsiang Ko^*, Chia Tien Wu, Mei Fen Chen, Jem Kun Chen, Tieh Chi Chu

^*Corresponding author for this work

National Chiao Tung University

Research output: Contribution to journal › Article

4 Scopus citations

Abstract

In this study, the authors used a soft-mold-induced self-construction method to fabricate three-dimensional patterns under microwave irradiation for 1 min. The authors estimated the actual pattern growth temperature using a fluorescence probe technique. The temperature at which pattern growth originated was, by necessity, higher than the glass transition temperature of the novolak resist. Electrostatic forces and surface tension effects under the electromagnetic field contributed significantly to the pattern growth, and the use of an antisticking agent allowed easy demolding.

Original language	English
Article number	191901
Journal	Applied Physics Letters
Volume	90
Issue number	19
DOIs	https://doi.org/10.1063/1.2737364
State	Published - 17 May 2007

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Ko, F-H., Wu, C. T., Chen, M. F., Chen, J. K., & Chu, T. C. (2007). Soft-mold-induced self-construction of polymer patterns under microwave irradiation. Applied Physics Letters, 90(19), [191901]. https://doi.org/10.1063/1.2737364

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