Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints

Yaodong Wang, Igor M. De Rosa, King-Ning Tu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Scopus citations

Abstract

We report tensile properties of intermetallic compound (IMC)-based solder joints. A systematic study of the mechanical properties of solder joint covering a broad size spectrum from BGA (ball grid array), flip chip joint, to microbump, which are key components used in 3D IC packaging, has been performed. We found that when the size of solder joint is smaller than 70 μm, brittle fracture tends to occur due to IMC embrittlement. When the solder joint size is greater than 70 μm, ductile fracture within solder itself is dominant. The brittleness for microbump in 5-20 μm in diameter used for 3D IC packaging will be a long term mechanical reliability issue as IMC-based solder joint is highly susceptible to brittle fracture. Besides focusing on strengthening for solder, more of research effort should be paid on how to increase the fracture toughness of the intermetallics for sub-20 μm micro-joints. Four different fracture mechanisms are also summarized in this paper for the mechanical failure of solder joints.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages632-639
Number of pages8
ISBN (Electronic)9781479986095
DOIs
StatePublished - 15 Jul 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 26 May 201529 May 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Conference

Conference2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period26/05/1529/05/15

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    Wang, Y., De Rosa, I. M., & Tu, K-N. (2015). Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 (pp. 632-639). [7159658] (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159658