Simultaneous hotspot temperature and supply noise reductions using thermal TSVs and decoupling capacitors

Yan Wun Wang, Pao Jen Huang, Tai Chen Chen, Chien-Nan Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In 3D IC architectures, the thermal and power noise problems affect the performance of the whole chip. In this paper, we present a method to solve these two problems by simultaneously adding thermal TSVs (T-TSV) for the thermal issue and decoupling capacitors (decap) for the power noise issue. Since the unit-area capacitance of a T-TSV at the room temperature is equivalent to that of a decap, and the unit-area capacitance of a T-TSV is arisen with increasing temperature, T-TSVs have the abilities of dissipating thermal and reducing power noise. We formulate these two abilities into a linear programming. Without enlarging the floorplan area, the proposed method can alleviate the temperature and voltage drop using linear programming under the given target temperature and the threshold of the voltage drop. Experimental results show that the maximum temperature and average temperature can be reduced 48% and 29%, respectively. The voltage drop can be reduced 273% and all voltage drops are lower than 0.3 voltages.

Original languageEnglish
Title of host publicationProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013
PublisherIEEE Computer Society
Pages245-248
Number of pages4
ISBN (Print)9781479913145
DOIs
StatePublished - 1 Jan 2013
Event5th Asia Symposium on Quality Electronic Design, ASQED 2013 - Penang, Malaysia
Duration: 26 Aug 201328 Aug 2013

Publication series

NameProceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013

Conference

Conference5th Asia Symposium on Quality Electronic Design, ASQED 2013
CountryMalaysia
CityPenang
Period26/08/1328/08/13

Keywords

  • decoupling capacitor
  • Hotspot
  • supply noise
  • temperature
  • thermal TSVs

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    Wang, Y. W., Huang, P. J., Chen, T. C., & Liu, C-N. (2013). Simultaneous hotspot temperature and supply noise reductions using thermal TSVs and decoupling capacitors. In Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013 (pp. 245-248). [6643595] (Proceedings of the 5th Asia Symposium on Quality Electronic Design, ASQED 2013). IEEE Computer Society. https://doi.org/10.1109/ASQED.2013.6643595