Simulation of three-dimensional copper-low-□ interconnections with different shapes

Yi-Ming Li; Jam Wem Lee; Hong Mu Chou

doi:10.1109/IWCE.2004.1407378

Simulation of three-dimensional copper-low-□ interconnections with different shapes

Yi-Ming Li^*, Jam Wem Lee, Hong Mu Chou

^*Corresponding author for this work

Institute of Communications Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

The geometry dependent RC time constant was studied for optimizing Cu-low-κ interconnects. Three simulated structures with cylindrical (CL), square (SQ) and rectangular (RE) shaped wires were fabricated for the study. Metal lines with different length and spacing in realistic IC manufacturing were also examined. It was found that the extracted C decreases with respect to the line space and RE structure has the lowest RC delay for the line width<110 nm. The results show that the Cu-low-κ process can be subjected to further adjustment for minimizing unwanted time delay.

Original language	English
Title of host publication	2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts
Pages	165-166
Number of pages	2
DOIs	https://doi.org/10.1109/IWCE.2004.1407378
State	Published - 24 Oct 2004
Event	2004 10th International Workshop on Computational Electronics: The Field of Computational Electronics - Looking Back and Looking Ahead, IEEE IWCE-10 2004, Abstracts - West Lafayette, IN, United States Duration: 24 Oct 2004 → 27 Oct 2004

Publication series

Name	2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts

Conference

Conference	2004 10th International Workshop on Computational Electronics: The Field of Computational Electronics - Looking Back and Looking Ahead, IEEE IWCE-10 2004, Abstracts
Country	United States
City	West Lafayette, IN
Period	24/10/04 → 27/10/04

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Li, Y-M., Lee, J. W., & Chou, H. M. (2004). Simulation of three-dimensional copper-low-□ interconnections with different shapes. In 2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts (pp. 165-166). (2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts). https://doi.org/10.1109/IWCE.2004.1407378

@inproceedings{0c822c97b43e43508d9b6194e29bcf9a,

title = "Simulation of three-dimensional copper-low-□ interconnections with different shapes",

abstract = "The geometry dependent RC time constant was studied for optimizing Cu-low-κ interconnects. Three simulated structures with cylindrical (CL), square (SQ) and rectangular (RE) shaped wires were fabricated for the study. Metal lines with different length and spacing in realistic IC manufacturing were also examined. It was found that the extracted C decreases with respect to the line space and RE structure has the lowest RC delay for the line width<110 nm. The results show that the Cu-low-κ process can be subjected to further adjustment for minimizing unwanted time delay.",

author = "Yi-Ming Li and Lee, {Jam Wem} and Chou, {Hong Mu}",

year = "2004",

month = oct,

day = "24",

doi = "10.1109/IWCE.2004.1407378",

language = "English",

isbn = "0780386493",

series = "2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts",

pages = "165--166",

booktitle = "2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts",

note = "null ; Conference date: 24-10-2004 Through 27-10-2004",

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Li, Y-M, Lee, JW & Chou, HM 2004, Simulation of three-dimensional copper-low-□ interconnections with different shapes. in 2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts. 2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts, pp. 165-166, 2004 10th International Workshop on Computational Electronics: The Field of Computational Electronics - Looking Back and Looking Ahead, IEEE IWCE-10 2004, Abstracts, West Lafayette, IN, United States, 24/10/04. https://doi.org/10.1109/IWCE.2004.1407378

Simulation of three-dimensional copper-low-□ interconnections with different shapes. / Li, Yi-Ming; Lee, Jam Wem; Chou, Hong Mu.

2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts. 2004. p. 165-166 (2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Chou, Hong Mu

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Y1 - 2004/10/24

N2 - The geometry dependent RC time constant was studied for optimizing Cu-low-κ interconnects. Three simulated structures with cylindrical (CL), square (SQ) and rectangular (RE) shaped wires were fabricated for the study. Metal lines with different length and spacing in realistic IC manufacturing were also examined. It was found that the extracted C decreases with respect to the line space and RE structure has the lowest RC delay for the line width<110 nm. The results show that the Cu-low-κ process can be subjected to further adjustment for minimizing unwanted time delay.

AB - The geometry dependent RC time constant was studied for optimizing Cu-low-κ interconnects. Three simulated structures with cylindrical (CL), square (SQ) and rectangular (RE) shaped wires were fabricated for the study. Metal lines with different length and spacing in realistic IC manufacturing were also examined. It was found that the extracted C decreases with respect to the line space and RE structure has the lowest RC delay for the line width<110 nm. The results show that the Cu-low-κ process can be subjected to further adjustment for minimizing unwanted time delay.

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M3 - Conference contribution

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BT - 2004 10th International Workshop on Computational Electronics, IEEE IWCE-10 2004, Abstracts

Y2 - 24 October 2004 through 27 October 2004

ER -

Simulation of three-dimensional copper-low-□ interconnections with different shapes

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