Simulation analysis of structure design for low temperature Cu-Cu direct bonding in heterogeneous integration and advanced packaging systems

Yu Ming Pan, Yu Tao Yang, Tzu Chieh Chou, Ting Yang Yu, Kai Ming Yang, Cheng Ta Ko, Yu Hua Chen, Tzyy Jang Tseng, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In order to realize Cu-Cu bonding at low temperature, Cu pillar-concave structures on silicon substrate and on silicon substrate with another polymer layer, polyimide (PI), are both investigated through simulation. Height of Cu pillar, thickness of upper and lower silicon substrate, and thickness of Cu concave are simulated in this paper. The proposed structure could have great impacts on current semiconductor packaging technology, such as improvement of joint strength, enhancement of adhesive strength between various substrates, a Cu-Cu bonding process lower than 200°C with simplified manufacturing process.

Original languageEnglish
Title of host publication13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PublisherIEEE Computer Society
Pages111-114
Number of pages4
ISBN (Electronic)9781538656150
DOIs
StatePublished - 24 Jan 2019
Event13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan
Duration: 24 Oct 201826 Oct 2018

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2018-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
CountryTaiwan
CityTaipei
Period24/10/1826/10/18

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