Simulating a Semiconductor Packaging Facility: Sustainable Strategies and Short-time Evidences

Yi Chi Wang*, Tin-Chih Chen, Li Chih Wang

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

Semiconductor packaging plays a crucial role in semiconductor manufacturing because it is among the closest steps to the end customers. However, the complexity of production conditions makes controlling a semiconductor packaging facility a challenging task, and dynamic factory simulation has been considered as an effective means to fulfill this task. The large amounts of money, time, efforts, and expertise required to conduct a factory simulation study force a semiconductor packaging firm to pursue the persistent application of the factory simulation model (i.e., the sustainability of the factory simulation model). This challenge has rarely been discussed in previous studies. This study proposed several strategies to enhance the sustainability of a factory simulation model. In addition, the effectiveness of these strategies were examined by identifying short-time evidence rather than observing for a long duration to enhance efficiency. According to the experimental results, the adoption of the quick start-up, scaled-down, and OOAD strategies reduced the requirement of money, time, and effort in building the factory simulation model, and enhanced the sustainability.

Original languageEnglish
Pages (from-to)787-795
Number of pages9
JournalProcedia Manufacturing
Volume11
DOIs
StatePublished - 1 Jan 2017

Keywords

  • packaging
  • semiconductor
  • simulation
  • strategy
  • sustainability

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