Semiconductor innovation into the next decade

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.

Original languageEnglish
Title of host publication2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages117-120
Number of pages4
ISBN (Electronic)9781479940905
DOIs
StatePublished - 13 Jan 2015
Event2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan
Duration: 10 Nov 201412 Nov 2014

Publication series

Name2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

Conference

Conference2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
CountryTaiwan
CityKaohsiung
Period10/11/1412/11/14

Keywords

  • 3DIC
  • CMOS
  • CoWoS
  • ecosystem
  • foundry
  • InFO
  • IoT
  • Moore's Law
  • platform
  • sensor
  • system scaling

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  • Cite this

    Sun, J. Y. C. (2015). Semiconductor innovation into the next decade. In 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers (pp. 117-120). [7008874] (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASSCC.2014.7008874