Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors

Chris Chun Chih Chung, Chun Ming Ko, Tien Sheng Chao*

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and Ioff is drastically reduced (two orders of magnitude) with increasing trimming cycles. Full silicidation on the source/drain (FUSI-S/D) is performed to improve Ion. Surprisingly, after silicidation, both Ion and boldsymbolmu _mathrm FE shows degradation despite that the series resistance is improved. An ultrathin body junctionless (UTB-JL) device is fabricated to investigate the degradation cause by direct CV measurement on the device, which can give us an insight into the details of the change with the silicidation.

Original languageEnglish
Article number8843925
Pages (from-to)959-963
Number of pages5
JournalIEEE Journal of the Electron Devices Society
Volume7
Issue number1
DOIs
StatePublished - 2019

Keywords

  • fully silicided-S/D
  • junctionless
  • low-temperature trimming
  • monolithic 3D-ICs
  • nanosheet
  • poly-Si
  • Self-Limit
  • vertically stacked

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