Self-aligned hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallization layer

Annie T. Huang, Chung Kuang Chou, Chih Chen*

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

An easy, low cost, and low temperature hermetic packaging technology, which uses eutectic SnPb solder and Cr/Ni/Cu bonding pad is described. The bonding results of silicon-silicon as well as silicon-glass, and glass-glass bonding are investigated. The advantage of solder, which is known for self-alignment property in flip chip technology, is in its metal property. The average misalignment in the soldered joints was found to be 11.2 μm and 13.6 μm for the square and circle samples, and the bonding strength ranged from 3 MPa to 10 MPa.

Original languageEnglish
Pages327-328
Number of pages2
DOIs
StatePublished - 1 Dec 2004
Event2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States
Duration: 13 Nov 200419 Nov 2004

Conference

Conference2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004
CountryUnited States
CityAnaheim, CA
Period13/11/0419/11/04

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