An easy, low cost, and low temperature hermetic packaging technology, which uses eutectic SnPb solder and Cr/Ni/Cu bonding pad is described. The bonding results of silicon-silicon as well as silicon-glass, and glass-glass bonding are investigated. The advantage of solder, which is known for self-alignment property in flip chip technology, is in its metal property. The average misalignment in the soldered joints was found to be 11.2 μm and 13.6 μm for the square and circle samples, and the bonding strength ranged from 3 MPa to 10 MPa.
|Number of pages||2|
|State||Published - 1 Dec 2004|
|Event||2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States|
Duration: 13 Nov 2004 → 19 Nov 2004
|Conference||2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004|
|Period||13/11/04 → 19/11/04|