Scrap rules for small lots in wafer fabrication

Muh-Cherng Wu, Chie Wun Chiou, Hsi Mei Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper presents a genetic algorithm for determining the rules for scrapping small lots in a semiconductor fab. Small lots are lots which carry less than 25 wafers due to yield problem. Simulation results show that the proposed approach can increase contribution margin up to 24% in the case of low yield and high average selling price.

Original languageEnglish
Title of host publication2002 Semiconductor Manufacturing Technology Workshop, SMTW 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages187-190
Number of pages4
ISBN (Electronic)0780376048, 9780780376045
DOIs
StatePublished - 1 Jan 2002
EventSemiconductor Manufacturing Technology Workshop, SMTW 2002 - Hsinchu, Taiwan
Duration: 10 Dec 200211 Dec 2002

Publication series

Name2002 Semiconductor Manufacturing Technology Workshop, SMTW 2002

Conference

ConferenceSemiconductor Manufacturing Technology Workshop, SMTW 2002
CountryTaiwan
CityHsinchu
Period10/12/0211/12/02

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  • Cite this

    Wu, M-C., Chiou, C. W., & Hsu, H. M. (2002). Scrap rules for small lots in wafer fabrication. In 2002 Semiconductor Manufacturing Technology Workshop, SMTW 2002 (pp. 187-190). [1197410] (2002 Semiconductor Manufacturing Technology Workshop, SMTW 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMTW.2002.1197410