Scattering of plane waves by two-dimensional periodic impedance surface

Ruey-Bing Hwang, S. T. Peng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have modeled a two-dimensional periodic structure by a two-dimensional impedance surface. The scattering of waves by such an impedance surface is rigorously formulated as a three-dimensional boundary-value problem, including the coupling between the TE and TM polarized waves. Numerical examples are given to illustrate physical phenomena associated with the structure.

Original languageEnglish
Title of host publicationIEEE Antennas and Propagation Society International Symposium
Subtitle of host publicationWireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1900-1903
Number of pages4
ISBN (Electronic)078035639X, 9780780356399
DOIs
StatePublished - 1 Jan 1999
Event1999 IEEE Antennas and Propagation Society International Symposium, APSURSI 1999 - Orlando, United States
Duration: 11 Jul 199916 Jul 1999

Publication series

NameIEEE Antennas and Propagation Society International Symposium: Wireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting
Volume3

Conference

Conference1999 IEEE Antennas and Propagation Society International Symposium, APSURSI 1999
CountryUnited States
CityOrlando
Period11/07/9916/07/99

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    Hwang, R-B., & Peng, S. T. (1999). Scattering of plane waves by two-dimensional periodic impedance surface. In IEEE Antennas and Propagation Society International Symposium: Wireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting (pp. 1900-1903). [788328] (IEEE Antennas and Propagation Society International Symposium: Wireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting; Vol. 3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APS.1999.788328