Ripening-assisted void formation in the matrix of lead-free solder joints during solid-state aging

J. W. Jang*, J. K. Lin, D. R. Frear, T. Y. Lee, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Void formation in lead-free solder joints, away from the joint interface, has been observed after solid-state aging. These voids are attached to intermetallic precipitates in the solder matrix, especially to those that are adjacent to the layered intermetallic at the joint interface. Two potential void formation mechanisms are discussed. The mechanism proposed to describe void formation is that a flux of vacancies is created due to volume contraction during solid-state reaction. The ripening process among the intermetallics also assists this process. Using the suggested mechanisms, the void size was estimated. This phenomenon differs from the classical Kirkendall void formation because it is a nonequilibrium state of void formation and stress generation.

Original languageEnglish
Pages (from-to)826-830
Number of pages5
JournalJournal of Materials Research
Volume22
Issue number4
DOIs
StatePublished - 1 Apr 2007

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