Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers

H. K. Kim*, King-Ning Tu, P. A. Totta

*Corresponding author for this work

Research output: Contribution to journalArticle

90 Scopus citations

Abstract

In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface at the bottom of the solder joint. It suggests that gravity plays a role.

Original languageEnglish
Pages (from-to)2204-2206
Number of pages3
JournalApplied Physics Letters
Volume68
Issue number16
DOIs
StatePublished - 15 Apr 1996

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