RF interconnects for communications on-chip

Mau-Chung Chang, Eran Socher, Sai Wang Tam, Jason Cong, Glenn Reinman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

47 Scopus citations

Abstract

In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well.

Original languageEnglish
Title of host publicationISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design
Pages78-83
Number of pages6
DOIs
StatePublished - 16 May 2008
Event2008 ACM International Symposium on Physical Design, ISPD 2008 - Portland, OR, United States
Duration: 13 Apr 200816 Apr 2008

Publication series

NameProceedings of the International Symposium on Physical Design

Conference

Conference2008 ACM International Symposium on Physical Design, ISPD 2008
CountryUnited States
CityPortland, OR
Period13/04/0816/04/08

Keywords

  • Chip MultiProcessors
  • Network-on-chip
  • RF-interconnect

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    Chang, M-C., Socher, E., Tam, S. W., Cong, J., & Reinman, G. (2008). RF interconnects for communications on-chip. In ISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design (pp. 78-83). (Proceedings of the International Symposium on Physical Design). https://doi.org/10.1145/1353629.1353649