Resin Transfer Molding (RTM) process of a high performance epoxy resin. I: kinetic studies of cure reaction

Chang Lun Lee, Jia Chong Ho, Kung-Hwa Wei

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160-197°C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion-controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.

Original languageEnglish
Pages (from-to)929-934
Number of pages6
JournalPolymer Engineering and Science
Volume40
Issue number4
DOIs
StatePublished - 1 Jan 2000

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