Research of mechanical properties of Copper foils with low temperature annealing.

Chuan Yu Fang, Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the development of the fifth-generation (5G) mobile communication network and artificial intelligence (AI), IC applications are moving towards diversification and ultimate performance. Demand drives the growth of technology, and the growth of technology is leading the advance of semiconductor industry. The semiconductor industry challenges the physical limits and aims to follow Moore's Law by reducing the size of the chip continuously, but the front-end process has reached the limit. Relying on the back-end packaging techniques to continue Moore's Law, packaging has progressed from 2D to 2.5D, and now it has progressed to 3D packaging. In 3D packaging, copper still plays an important role. Copper is the main material of TSV, and it is used in copper to copper direct bonding [1], which shows the importance of copper to the development of technology, so we are committed to studying the property of copper.

Original languageEnglish
Title of host publicationInternational Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
PublisherIEEE Computer Society
Pages256-258
Number of pages3
ISBN (Electronic)9781728198514
DOIs
StatePublished - 21 Oct 2020
Event15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan
Duration: 21 Oct 202023 Oct 2020

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2020-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
CountryTaiwan
CityTaipei
Period21/10/2023/10/20

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