Abstract
Semiconductor manufacturing is very capital intensive and competitive. It is important to optimize the utilization of various resources to generate the outputs efficiently for maintaining competitive advantages. This research aims to conduct data envelopment analysis based on UNISON framework for inter-fab performance evaluation with multiple indices from the constructed objective hierarchy. An empirical study was conducted with real data collected from a leading Taiwan semiconductor company to estimate the validity of the proposed approach. The results can support the decision maker to determine the improvement directions for appropriate resource allocations and thus demonstrate the practical viability of the proposed approach.
| Original language | English |
|---|---|
| Pages (from-to) | 427-444 |
| Number of pages | 18 |
| Journal | Journal of Quality |
| Volume | 20 |
| Issue number | 4 |
| DOIs | |
| State | Published - 1 Jan 2013 |
Keywords
- Data envelopment analysis
- Decision quality
- Inter-fab performance evaluation
- Semiconductor manufacturing
- Total resource management
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Chou, M. H., Chen, W-C., & Chien, C. F. (2013). Research for constructing the inter-fab performance evaluation model to enhance the resource allocation decision quality. Journal of Quality, 20(4), 427-444. https://doi.org/10.6220/joq.2013.204.04