Reliability of micro-interconnects in 3D IC packages

C. Robert Kao*, Albert T. Wu, King-Ning Tu, Yi Shao Lai

*Corresponding author for this work

Research output: Contribution to journalEditorial

8 Scopus citations
Original languageEnglish
Number of pages1
JournalMicroelectronics Reliability
Volume53
Issue number1
DOIs
StatePublished - 1 Jan 2013

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