Reliability issues of Pb-free solder joints in electronic packaging technology

King-Ning Tu, K. Zeng

Research output: Contribution to journalArticle

36 Scopus citations

Abstract

At present, the electronic packaging industry is actively searching for Pb-free solders due to environmental concern of the Pb-contain solders. Owing to the lack of reliability data, some electronic companies are reluctant to adopt Pb-free solders into their products. Hence, a review of the reliability issues of Pb-free solders is timely. We have selected three topics to be reviewed here. They are interfacial reaction between Pb-free solder and thin film under-bump metallization, electromigration in Pb-free flip chip solder joints, and Sn whisker growth on Pb-free finish on Cu leadframe.

Original languageEnglish
Pages (from-to)1194-1200
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
DOIs
StatePublished - 1 Jan 2002

Fingerprint Dive into the research topics of 'Reliability issues of Pb-free solder joints in electronic packaging technology'. Together they form a unique fingerprint.

  • Cite this