At present, the electronic packaging industry is actively searching for Pb-free solders due to environmental concern of the Pb-contain solders. Owing to the lack of reliability data, some electronic companies are reluctant to adopt Pb-free solders into their products. Hence, a review of the reliability issues of Pb-free solders is timely. We have selected three topics to be reviewed here. They are interfacial reaction between Pb-free solder and thin film under-bump metallization, electromigration in Pb-free flip chip solder joints, and Sn whisker growth on Pb-free finish on Cu leadframe.
|Number of pages||7|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - 1 Jan 2002|