Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration

Yu Tao Yang, Yu Chen Hu, Kuan-Neng Chen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A breakthrough in vertical stacking and bonding method in flexible substrates is developed and presented in this paper. Unlike current ACF and NCP approaches, which are used in most manufacturing industry, our novel stacking method uses only metal thin film as bonding material. Two different bonding material bumps are carried out in our experiment. Both show better electrical and reliability outcomes compared to current methods. Our proposed method can reach ultra-fine pitch, metal bonding without polymer material, simplified manufacturing process, better electrical performance and less reliability issues. It can be considered as a future bendable and flexible substrate stacking approach.

Original languageEnglish
Title of host publication2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509013999
DOIs
StatePublished - 5 Jul 2017
Event2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 - San Francisco, United States
Duration: 8 Nov 201611 Nov 2016

Publication series

Name2016 IEEE International 3D Systems Integration Conference, 3DIC 2016

Conference

Conference2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
CountryUnited States
CitySan Francisco
Period8/11/1611/11/16

Keywords

  • 3D Integration
  • Bonding
  • Flexible Substrate
  • ultrafine pitch

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