Redundant via insertion with wire spreading capability

Yu-Min Lee*, Chi Wen Pan

*Corresponding author for this work

Research output: Contribution to journalArticle


Redundant via insertion is a widely recommended technique to enhance the via yield and reliability. In this work, the post-routing redundant via insertion problem is transformed to a mixed bipartite-conflict graph matching problem, and an efficient minimum weighted matching algorithm is developed to solve the matching problem. The developed method not only inserts redundant vias for alive vias but also protects dead vias by utilizing the wire spreading capability - that's to say, wire segments are spread into the empty space, then, redundant vias can be inserted for dead vias to further enhance the via yield. Experimental results show that the redundant via insertion rate for alive vias can be over 99.86% on average. With only 0.104% wirelength overhead on average, the developed wire spreading technique can achieve an average redundant via insertion rate for alive dead vias of 95.61 %, and the dead via protection rate can be 21.96% on average.

Original languageEnglish
Pages (from-to)383-397
Number of pages15
JournalInternational Journal of Electrical Engineering
Issue number6
StatePublished - 1 Dec 2010


  • Layout pushing capability
  • Redundant via insertion
  • Wire spreading capability
  • Yield improvement

Fingerprint Dive into the research topics of 'Redundant via insertion with wire spreading capability'. Together they form a unique fingerprint.

Cite this