Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang, Fu Hsin Chen, Meng Yen Chen, Yew-Chuhg Wu

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

Original languageEnglish
Pages (from-to)R140-R143
JournalECS Journal of Solid State Science and Technology
Volume4
Issue number9
DOIs
StatePublished - 1 Jan 2015

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