Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process

Chun Fu Lin, Hong Ren Fang, Jyh Rou Sze, Sheng-Fuu Lin, Chi Hung Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The major defect in integrated circuit wafers after the sawing process is the unexpected cracking from the sawing lane that damages the die area. Traditional defect detection algorithms for integrated circuit wafers after the sawing process can be divided into two parts. The first part is locating the sawing lane area and the second is detecting defects in the sawing lane area. The traditional methods take too long to locate the sawing lane area. To overcome this, this paper proposes a novel method for locating the sawing lane area using low-resolution and gray-value input images. After the sawing lane area is extracted from the original image, defects can be detected by traditional defect detection methods in the sawing lane area or by the method proposed in this paper. Using the proposed defect detection method is faster and better for real-time operation than traditional methods since the proposed method is more concise. Finally, a pioneering image data acquisition and inspection system for integrated circuit wafers after the sawing process is proposed in this paper. Furthermore, the proposed system works in real time because its architecture operates quickly and its proposed algorithm is simple, using low-resolution, gray-value images. Therefore, the proposed system can operate in real time and maintain a high-level detection rate.

Original languageEnglish
Title of host publicationI2MTC 2016 - 2016 IEEE International Instrumentation and Measurement Technology Conference
Subtitle of host publicationMeasuring the Pulse of Industries, Nature and Humans, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467392204
DOIs
StatePublished - 22 Jul 2016
Event2016 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2016 - Taipei, Taiwan
Duration: 23 May 201626 May 2016

Publication series

NameConference Record - IEEE Instrumentation and Measurement Technology Conference
Volume2016-July
ISSN (Print)1091-5281

Conference

Conference2016 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2016
CountryTaiwan
CityTaipei
Period23/05/1626/05/16

Keywords

  • inspection system
  • integrated circuit wafer
  • sawing lane

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    Lin, C. F., Fang, H. R., Sze, J. R., Lin, S-F., & Hwang, C. H. (2016). Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process. In I2MTC 2016 - 2016 IEEE International Instrumentation and Measurement Technology Conference: Measuring the Pulse of Industries, Nature and Humans, Proceedings [7520497] (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Vol. 2016-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/I2MTC.2016.7520497