Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process

C. Key Chung, Y. J. Chen, T. L. Yang, C. R. Kao

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

Early formation of Cu6Sn5 and (Ni,Cu) 6Sn5 during soldering was investigated. Sn 4.0Ag0.5Cu solder on Cu and electroless Ni-Au substrate was quenched in ice water after the initial stage of melting, and the solder-substrate interface was analyzed by transmission electron microscopy and energy-dispersive x-ray spectroscopy. At the contacting point, Cu3Sn and Cu6Sn5 were found at the solder-Cu substrate interface, while (Ni,Cu)6Sn5 and Ni2SnP were identified at the solder-electroless Ni interface. The contacting points were confirmed as the sites of heterogeneous nucleation. TEM analysis suggested that the nucleation of both intermetallic compounds can be attributed to diffusion-induced crystallization. Details of the early interfacial reactions are discussed.

Original languageEnglish
Pages (from-to)1254-1259
Number of pages6
JournalJournal of Electronic Materials
Volume42
Issue number6
DOIs
StatePublished - Jun 2013

Keywords

  • early melting process
  • intermetallic alloys and compounds
  • lead-free solder
  • Nanostructures
  • surface and interfaces

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