Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction

Tian Tian*, Kai Chen, Martin Kunz, Nobumichi Tamura, Chau Jie Zhan, Tao Chih Chang, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages882-885
Number of pages4
DOIs
StatePublished - 4 Oct 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 29 May 20121 Jun 2012

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CountryUnited States
CitySan Diego, CA
Period29/05/121/06/12

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