Precipitation of large Ag 3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

Ruo Wei Yang, Yuan Wei Chang, Wei Chi Sung, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

18 Scopus citations

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Physics & Astronomy

Chemical Compounds

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