Precipitation of large Ag 3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging

Ruo Wei Yang, Yuan Wei Chang, Wei Chi Sung, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

18 Scopus citations

Abstract

Microbumps have been adopted as interconnects between Si chips in 3D integrated-circuit packaging. The solder volume of a microbump decreases dramatically due to fine-pitch requirement and it is approximately two orders smaller in magnitude than that of a traditional flip-chip solder joint. The metallurgical reactions in the microbumps may behave quite differently to those in flip-ship bumps. Liquid-state metallurgical reactions were examined in SnAg2.5 microbumps with Ni metallization. The results indicate that large particles of Ag 3Sn intermetallic compounds (IMCs) precipitate after a 10-min reflow on microbumps with 4.0-μm-thick solder, which does not occur with flip-chip solder bumps. It is proposed that the Ag concentration in the remaining solder may increase as Sn reacts with Ni. The increase in the Ag concentration is mainly responsible for the occurrence of the large Ag 3Sn precipitates. The formation of these Ag 3Sn IMCs would be detrimental to the mechanical properties of the microbumps.

Original languageEnglish
Pages (from-to)340-344
Number of pages5
JournalMaterials Chemistry and Physics
Volume134
Issue number1
DOIs
StatePublished - 15 May 2012

Keywords

  • Intermetallics
  • Joining
  • Pb-free solder alloys

Fingerprint Dive into the research topics of 'Precipitation of large Ag <sub>3</sub>Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging'. Together they form a unique fingerprint.

Cite this