Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing

T. C. Huang, T. L. Yang, J. H. Ke, C. C. Li, C. R. Kao*

*Corresponding author for this work

Research output: Contribution to journalLetterpeer-review

15 Scopus citations

Abstract

Nickel diffuses five orders of magnitude faster along the c-axis of white Sn than along the a-axis. Experimental evidence is presented to show that, when Ni atoms diffuse from a Sn grain with its c-axis aligned with the Ni flux direction, across the grain boundary, and then into a neighboring Sn grain with its a-axis aligned with the Ni flux direction, Ni3Sn4 will preferentially precipitates at the Sn grain boundary. This is a direct proof that precipitation can be caused by the diffusivity anisotropy of a diffusion medium.

Original languageEnglish
Pages (from-to)237-240
Number of pages4
JournalJournal of Alloys and Compounds
Volume555
DOIs
StatePublished - 5 Apr 2013

Keywords

  • Crystallography orientation
  • Electromigration
  • Intermetallic compound
  • Precipitation

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