Powerful polymeric thermal microactuator with embedded silicon microstructure

Gih Keong Lau*, J. F.L. Goosen, F. Van Keulen, T. Chu Duc, P. M. Sarro

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Scopus citations


A powerful and effective design of a polymeric thermal microactuator is presented. The design has SU-8 epoxy layers filled and bonded in a meandering silicon (Si) microstructure. The silicon microstructure reinforces the SU-8 layers by lateral restraint. It also improves the transverse thermal expansion coefficient and heat transfer for the bonded SU-8 layers. A theoretical model shows that the proposed SU-8/Si composite can deliver an actuation stress of 1.30 MPaK, which is approximately 2.7 times higher than the unconstrained SU-8 layer, while delivering an approximately equal thermal strain.

Original languageEnglish
Article number214103
JournalApplied Physics Letters
Issue number21
StatePublished - 1 Jun 2007

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