Power noise suppression technique using active decoupling capacitor for TSV 3D integration

Tien Hung Lin*, Po-Tsang Huang, Wei Hwang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65nm CMOS technology and TSV model at 1V supply voltage, the proposed noise suppression circuit can realize maximum 7.4dB supply noise reduction and 12X boost fact at the resonant frequency.

Original languageEnglish
Title of host publicationProceedings - IEEE International SOC Conference, SOCC 2010
Pages209-212
Number of pages4
DOIs
StatePublished - 1 Dec 2010
Event23rd IEEE International SOC Conference, SOCC 2010 - Las Vegas, NV, United States
Duration: 27 Sep 201029 Sep 2010

Publication series

NameProceedings - IEEE International SOC Conference, SOCC 2010

Conference

Conference23rd IEEE International SOC Conference, SOCC 2010
CountryUnited States
CityLas Vegas, NV
Period27/09/1029/09/10

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